Stephanie L. Crawford
Overview
Stephanie Crawford is a trusted counselor to a broad range of industries facing reorganizations, transactions, national security issues, and questions of supply chain management. Stephanie provides related mergers and acquisitions, counseling, litigation, international arbitration, and investigations services to clients in the aerospace and defense, communications, energy, information technology, and consumer products sectors.
Career & Education
- Indiana University of Pennsylvania, Robert E. Cook Honors College, B.A., economics, international studies, and history, 2011
- University of Maryland School of Law, J.D., 2016
- District of Columbia
- Maryland
- U.S. Court of Federal Claims
- U.S. Court of Appeals for Veterans Claims
Stephanie's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Client Alert | 2 min read | 06.21.24
DoD Expands Restrictions on Supply Chain for Certain Magnets, Tantalum, and Tungsten
Client Alert | 4 min read | 06.06.24
Client Alert | 5 min read | 05.08.24
Representative Matters
- Leading buy-side government contractor acquisition diligence for private equity firms, including small businesses and carve-out acquisitions.
- Supporting sell-side government contractor transactions, including complex carve-out transactions.
- Representing a defense contractor in litigation and international arbitration facing a challenge to an offset contract relationship, including tortious interference claims.
- Conducting due diligence or compliance reviews for defense contractors, industrial and information technology equipment and component part manufacturers, a personal transportation consumer product manufacturer, and an international automotive parts manufacturer.
- Guiding government contractors through foreign ownership, control, or influence mitigation and facility clearance requests and reporting requirements.
- Counseling clients on compliance with the FY 2019 National Defense Authorization Act Section 889 and subsequent regulations (including sourcing restrictions on Huawei and other covered telecommunications and video surveillance equipment and services providers).
- Advising clients on emerging printed circuit board and microelectronics sourcing and supply chain risk management compliance requirements.
Stephanie's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Client Alert | 2 min read | 06.21.24
DoD Expands Restrictions on Supply Chain for Certain Magnets, Tantalum, and Tungsten
Client Alert | 4 min read | 06.06.24
Client Alert | 5 min read | 05.08.24
Stephanie's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Client Alert | 2 min read | 06.21.24
DoD Expands Restrictions on Supply Chain for Certain Magnets, Tantalum, and Tungsten
Client Alert | 4 min read | 06.06.24
Client Alert | 5 min read | 05.08.24