Kate Beale
Areas of Focus
Overview
Kate Beale is a senior policy director in Crowell & Moring's Government Affairs Group and affiliated with C&M International, the global government relations, public policy, and public affairs affiliate of Crowell & Moring in the Washington, D.C. office. She supports clients in their efforts to shape legislative and regulatory policy. Kate brings 20 years of experience leading foreign policy, global health, humanitarian assistance and economic policy at the grassroots level, Congress, Obama administration, and private sector.
Career & Education
- U.S. Agency for International Development
Deputy Assistant Administrator, 2016–2017
White House Liaison, 2010–2013
Senate and Latin America and Caribbean Congressional Liaison Officer, 2010–2013 - U.S. Senate
Acting Legislative Director and Legislative Assistant, 2009–2010
Legislative Aide and Grants Officer, 2005–2009
Legislative Correspondent, 2005–2009
Staff Assistant, 2005–2009 - Peace Corps
Director of Congressional Relations, 2013–2016
Director of Peace Corps Response, 2013–2016
Returned Volunteer – Paraguay, 2002–2005
- U.S. Agency for International Development
- Boston University, B.A.
- Dublin City University, European Studies
Professional Activities and Memberships
- National Women’s Hall of Fame, 2021 Induction Ceremony Co-Chair
- Little Folks School, Board Member
Kate's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Firm News | 2 min read | 12.11.23
The Hill Names Crowell & Moring’s Jim Flood, Aaron Cummings, and Kate Beale Top Lobbyists of 2023
Press Coverage | 12.06.23
Client Alert | 14 min read | 11.02.23
Recognition
- The Hill: Top Lobbyist, 2023
Kate's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Firm News | 2 min read | 12.11.23
The Hill Names Crowell & Moring’s Jim Flood, Aaron Cummings, and Kate Beale Top Lobbyists of 2023
Press Coverage | 12.06.23
Client Alert | 14 min read | 11.02.23
Kate's Insights
Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Firm News | 2 min read | 12.11.23
The Hill Names Crowell & Moring’s Jim Flood, Aaron Cummings, and Kate Beale Top Lobbyists of 2023
Press Coverage | 12.06.23
Client Alert | 14 min read | 11.02.23