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Whistleblowing – A Guide to Compliance: Part 4

Client Alert | 2 min read | 07.14.21

Crowell & Moring LLP’s 2021 series of client alerts: Whistleblowing – A Guide to Compliance is intended to provide companies with a practical guide to help them comply with their obligations under the EU Whistleblower Directive. Via a monthly alert, Crowell & Moring LLP will explain the different steps that companies need to take for compliance and emphasize various points for consideration. Step #4: Check the steps you should already be taking to ensure your company’s compliance with the EU Whistleblower Directive and the national laws that implement it.

1. Summary of the different steps and action points that can already be undertaken for compliance with the EU Whistleblower Directive

In our previous Alerts in this series, we have drawn attention to some of the steps and action points that companies can already undertake with a view to compliance:

2. Current status of the implementation of the EU Whistleblower Directive in the various EU member states

Click to view this chart.

Conclusion:

From the overview set out above, it can be seen that although some major EU member states are already well advanced in the transposition of the EU Whistleblower Directive (the Netherlands, Sweden), most countries are lagging behind. As a result, there is a definite risk that these countries will not meet the deadline for transposition of the Directive of December 17, 2021. The coming months will be crucial in determining whether the deadline of December 17, 2021 is realistic and whether the European Commission might agree to an extension of this deadline.

  • Action point #4: Monitor the different EU member states’ national implementation of the EU Whistleblower Directive to identify specific national requirements.

Insights

Client Alert | 1 min read | 07.11.24

All That and a Bag of CHIPS: Commerce Department Prepares to Open Third Round of CHIPS Act Funding for R&D for Semiconductor Advanced Packaging

On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program.  The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation.  The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence.  The NOI also provides information about eligibility expectations and other anticipated requirements for applications....