SCOTUS to Review the Doctrine of Assignor Estoppel
Client Alert | less than 1 min read | 02.04.21
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Client Alert | 1 min read | 07.11.24
On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program. The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation. The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence. The NOI also provides information about eligibility expectations and other anticipated requirements for applications.
Client Alert | 35 min read | 07.11.24
Client Alert | 6 min read | 07.10.24
Client Alert | 6 min read | 07.08.24