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2015 Antitrust M&A Year in Review

Client Alert | 1 min read | 01.26.16

Crowell & Moring LLP is pleased to release its "2015 Antitrust M&A Year in Review." Following a record-breaking year for volume of transactions, this publication provides insight and analysis into developments and trends in global antitrust enforcement of mergers and acquisitions. We examine the antitrust agencies' increasing focus on protecting innovation and emerging forms of competition, requiring broader remedies and more competitive divestiture buyers, and highly scrutinizing transactions in markets where prior consolidation was not challenged. We also look at the agencies' increasing willingness to challenge transactions through litigation, and their relatively successful recent track record.

The report spotlights areas that were particularly noteworthy in 2015, including telecom, health care, energy, and IP and innovation. We also take a look at the first year of Commissioner Vestager's merger enforcement in Europe, the growing influence of third parties in merger review proceedings, and procedural trends at the Federal Trade Commission and Department of Justice Antitrust Division that impact the cost and timeline of merger review in the U.S.

Given the likelihood that recent antitrust merger enforcement developments foreshadow what to expect in the coming year, the 2015 Antitrust M&A Year in Review provides insight into trends that will be highly relevant going forward. We hope that you will find this report useful and welcome your feedback.

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2015 Antitrust M&A Year in Review

2015 Antitrust M&A Year in Review

Insights

Client Alert | 1 min read | 07.11.24

All That and a Bag of CHIPS: Commerce Department Prepares to Open Third Round of CHIPS Act Funding for R&D for Semiconductor Advanced Packaging

On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program.  The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation.  The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence.  The NOI also provides information about eligibility expectations and other anticipated requirements for applications....