1. Home
  2. |Insights
  3. |Veterans Day Sees Uncle SAM.gov Absorb FedBizOpps

Veterans Day Sees Uncle SAM.gov Absorb FedBizOpps

Client Alert | less than 1 min read | 11.19.19

Over the Veterans Day weekend, the General Services Administration closed the FedBizOpps (FBO) website, used for posting all open government contracting opportunities, and migrated FBO’s functionality to beta.SAM.gov. By way of the migration, GSA enhanced FBO’s search functionality on beta.SAM.gov; instituted two-factor login authentication; and attempted to improve the site’s user interface. FBO is the third of ten procurement systems to migrate to beta.SAM.gov. Although a smooth transition was promised, the new website requires users to create a new log in to access the website, and users are experiencing latency and slow performance that at times result in users being unable to log in to the application.

Insights

Client Alert | 1 min read | 07.11.24

All That and a Bag of CHIPS: Commerce Department Prepares to Open Third Round of CHIPS Act Funding for R&D for Semiconductor Advanced Packaging

On July 9, 2024, the CHIPS Research and Development Office released a Notice of Intent (NOI) to announce a third CHIPS Act Notice of Funding Opportunity (NOFO), which will be the first focused on the CHIPS National Advanced Packaging Manufacturing Program.  The NOFO will provide up to $1.6 billion for research and development activities in five areas of semiconductor advanced packaging, including (1) equipment, tools, processes and process integration; (2) power delivery and thermal management; (3) connector technology like photonics and radio frequency; (4) the chiplets ecosystem; and (5) co-design/electronic design automation.  The NOFO is expected to include prototype development opportunities in exemplar applications including high-performance computing and low-power systems needed for artificial intelligence.  The NOI also provides information about eligibility expectations and other anticipated requirements for applications....